Two Graduate Research Scholarship Positions at the Mobile Computing Lab., Chosun University, Gwangju, Republic of Korea (South Korea) === The Mobile Computing Lab. is seeking for skillful, hard working and creative candidates with good credentials to join our dynamic international team as Ph.D. or Master Students in the area of wireless networking and mobile computing (including related fields). -Expected entrance date: September 1st (Fall semester) Profile of Ideal Candidates -For Ph.D. applicants: 75% or higher of cumulative GPA/marks/score (preferably in Computer/Communications Engineering or related areas) -For M.S. or integrated M.S.–Ph.D. applicants: 75% or higher of cumulative GPA/marks/score -Good programming skills in C/C++ -Good English language skills: TOEFL IBT 90, IELTS 6.5 or higher if your mother tongue is not English -Good ability to cooperate with others in a multicultural environment -Good ability for highly self-motivated independent research Application Procedure -Interested applicants should send the following to Prof. Sangman Moh at the email address below by Friday, Apr. 24th via email: 1. CV (including names, date of birth, nationality, gender, contact details, education, work experience, publications, and TOEFL/IELTS score if English is not your mother tongue) 2. Scanned academic transcripts of B.S. (and M.S. for Ph.D. applicants) 3. Scanned TOEFL/IELTS score report 4. Optional one-page study plan (clearly stating the research topics you are interested in. We would like to know your research interests and their relation to those of our Lab.) Only electronic applications are accepted. The above items 1, 2, 3 and 4 should be either merged as one PDF file or zipped into one file.) All the files should be in the format of .PDF or .DOC. The files must be sent by the stated date and should have “Application to Graduate Research Scholarships for Fall 2015 at MCL (Familyname)” as the e-mail title. For any further questions about the positions, please contact: Prof. Sangman Moh, Ph.D. at the email address below.
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